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Intel will invest 7 billion USD to grow Malaysian chip packaging plant capacity
According to the latest report, a press invitation letter indicated that Intel will invest 7 billion USD to expand its presence in Penang, Malaysia. The production capacity of the advanced semiconductor packaging plant in Penang.
Moreover, Intel is scheduled to hold a press conference on this investment at Kuala Lumpur International Airport in Malaysia on Wednesday. At that time, Intel CEO Patrick Paul Gelsinger, Malaysian Trade Minister Azmin Ali, and Malaysian Investment Development Authority (MIDA) CEO Aham Abdul Rahman (Arham Abdul Rahman) will attend the press conference.
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The invitation letter stated that Intel’s expansion of the production capacity of its advanced semiconductor packaging plant in Malaysia will strengthen its supporting activities and further strengthen Intel’s global service center. At the same time, this investment will also position Malaysia as one of the key centers for manufacturing and shared services.
In Malaysia, factory closures caused by the epidemic have damaged the supply of chips for many companies. Intel relies on the Malaysian market for chip packaging, which is also the key last step in the semiconductor manufacturing process.