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New leak reveals Huawei Mate X3 equipped with HiSilicon Kirin 9000 4G chip
Recently, a new Huawei 4G phone model PAL-AL00 passed the network access review of the Ministry of Industry and Information Technology, running HarmonyOS, it was reported that this is Huawei Mate X3 folding-screen phone, Huawei is expected to launch this year.
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Moreover, the revealer @Digital Chat Station revealed that the Huawei Mate X3 device is equipped with the HiSilicon Kirin 9000 4G chip. All screens use a high-brush screen, still, an internal folding solution, equipped with a 4500mAh battery, and pre-installed with the new features of HarmonyOS 2.0.1, there may be changes in the production version.
It is reported that Huawei Mate X2 has introduced super-strength steel material, which can resist impact without deformation. In addition, carbon fiber composite material is added to ensure lightness while achieving high strength. There are also hidden opening and closing designs on both sides of the hinge, which can prevent objects from entering and prevent screen damage.