According to the latest report, Canon is developing a lithography machine for semiconductor 3D technology. New Canon lithography machines are expected to be launched in the first half of 2023 at the earliest. The exposure area has been expanded to approximately 4 times that of existing products, enabling the production of large semiconductors for AI use.
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The way 3D technology can improve performance is by stacking multiple semiconductor chips so that they are closely connected. According to reports, on the plate-shaped parts where the chips are placed, multi-layer fine wirings that electrically connect each chip are formed at a high density.
Moreover, Canon is developing a new type of lithography machine for forming such wirings. Optical components such as lenses and stages are improved to improve exposure accuracy and wiring density. It is said that the resolution of ordinary lithography machines is more than ten microns, but the new products can also support line widths of 1 micron.
In the field of cutting-edge semiconductors, 3D technology can improve the performance of semiconductors by stacking multiple chips. In this field, 3D semiconductor lithography machines are very important equipment, and our company has also made achievements in this field.
Furthermore, on February 7 this year, Shanghai Microelectronics held the delivery ceremony of the first 2.5D / 3D advanced packaging lithography machine, which marked the official delivery of China’s first 2.5D / 3D advanced packaging lithography machine to customers.
At the financial report meeting on March 28, Huawei Guo Ping said that Huawei will invest in three reconstructions in the future, using stacking and area for performance, and using less advanced technology to make Huawei’s products competitive. ” Solving chip problems is a complicated and long process that requires patience. In the future, our chip solution may adopt a multi-core structure to improve chip performance.”
