Huawei publishes patent for ‘chip stacking packages and terminal equipment’

Huawei disclosed a patent for a chip stacking package and terminal equipment to solve the problem of high cost caused by the use of through-silicon via technology.

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According to the patent information of the State Patent Office, Huawei Technologies Co., Ltd. published a chip-related patent on April 5, with the publication number CN114287057A.

The patent abstract shows that this is a chip stacking package and terminal equipment, involving the field of semiconductor technology, which can solve the problem of high cost caused by the use of through-silicon via technology while ensuring the power supply demand.

The patent documents show that the chip stack package (01) includes:

• A first chip (101) and a second chip (102) were disposed of between the first wiring structure (10) and the second wiring structure (20);

• The active surface (S1) of the first chip (101) faces the active surface (S2) of the second chip (102);

• The active surface (S1) of the first chip (101) includes a first overlapping area (A1) and a first non-overlapping area (C1), and the active surface (S2) of the second chip (102) includes a second overlapping area (C1) an overlapping area (A2) and a second non-overlapping area (C2);

• The first overlapping area (A1) overlaps the second overlapping area (A2), and the first overlapping area (A1) and the second overlapping area (A2) are connected;

• The first non-overlapping region (C1) is connected with the second wiring structure (20);

• The second non-overlapping region (C2) is connected with the first wiring structure (10).

(VIA)