According to the “2022 Global Wafer Capacity Report” by research firm Knometa Research, 57% of the total global wafer capacity in 2021 will be contracted by the top five companies (Samsung, TSMC, Micron, SK Hynix, Kioxia/Western Digital), which means that the industry’s “top-heavy” competitive landscape has further deepened.
Join tip3x on Telegram
Moreover, the report shows that the five companies will have a combined monthly production capacity of 12.2 million wafers in 2021, a 10% increase from the previous year and a growth rate that is one percentage point higher than the industry’s total capacity.
Among them, Samsung has the highest production capacity, accounting for 19% of the total global IC wafer production capacity by the end of 2021, 44% higher than the second-ranked TSMC. Samsung increased its capital spending by 45% in 2020, with most of the money going to building multiple 12-inch wafer production lines at its Pyeongtaek fab.
TSMC’s relatively modest capacity growth in 2021, but strong demand for its services spurred a significant increase in capex that year, which should lead to higher capacity growth in 2022. TSMC also plans to maintain aggressive spending in 2022 and 2023.
