With the rapid development of the electronic industry, the heat generated per unit area has also risen sharply while the electronic equipment has become increasingly miniaturized, multi-functional, and high-performance. Therefore, heat dissipation has become a crucial issue, which largely restricts the performance of electronic devices.
Recently, OPPO and Wuhan University launched the “Ice Skin Cooling Protective Case”. The interior of the phone case is covered with a new type of Glacier Mat material, which absorbs moisture in the air and takes away the heat of the phone through moisture evaporation.
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Moreover, this design is very convenient for the evaporation of water, and the surface of the ice skin heat dissipation protective shell is covered with grilles, and the appearance is also very high.
Furthermore, this cooling solution is an invention patent named “Heat Dissipation and Electronic Equipment” that OPPO applied for on December 28, 2020 (application number: 202023232117.2), and the applicant is OPPO Guangdong Mobile Communications Co., Ltd.
According to the relevant information currently disclosed in the patent, let us take a look at the secret behind this cooling solution. As shown in the figure, it is a schematic diagram of the structure of the heat sink 100 invented in this patent.
The heat sink mainly includes a housing 10 and a hydrogel phase change structure 20. The first cavity wall 12 is provided with a ventilation hole 14 on the first cavity wall. The heat-conducting bottom wall and the first cavity wall are surrounded to form a receiving cavity 13 in which the hydrogel phase change structure is accommodated.
The heat-conducting bottom wall can transfer heat to the hydrogel phase change structure in the receiving cavity. After the hydrogel phase change structure absorbs heat to the phase change temperature, the internal water evaporates to generate water vapor.
Due to the blocking effect of the heat-conducting bottom wall, the generated water vapor diffuses to the outside of the heat sink through the ventilation holes on the first cavity wall, so as to achieve the effect of heat dissipation.
More importantly, the hydrogel phase change structure can absorb water vapor from the outside through the ventilation holes on the first cavity wall to ensure the internal moisture content of the hydrogel phase change structure, so as to achieve long-term effective circulating heat dissipation.
Therefore, the latent heat of this hydrogel phase transition structure is high, and a large amount of heat can be taken away during the phase transition process, thereby realizing fast and efficient heat dissipation. The heat sink can achieve heat dissipation without external energy, which is greener and environmentally friendly and has an excellent heat dissipation effect.
The distribution of the hydrogel phase change units proposed in the patent. The hydrogel phase change structure is composed of a plurality of hydrogel phase change units 21 arranged at intervals. The gap between them is communicated with the ventilation holes, and by arranging a plurality of hydrogel phase change units, it is beneficial to conduct large-area heat dissipation.
The plurality of hydrogel phase change units is arranged at intervals, which saves the use of the hydrogel phase change material. At the same time, the gaps between the adjacent hydrogel phase change units are connected with the ventilation holes, thereby generating water vapor channels and ensuring the diffusion of water vapor.
The electronic device wearing such a heat dissipation device as shown in the patent, wherein the electronic device 400 includes the housing 200, the heating element 300, and the heat dissipation device 100. The heat sink is worn on the casing and is arranged corresponding to the heating element, and the heat-conducting bottom wall 11 of the heat sink is arranged between the hydrogel phase change structure 20 and the heating element.
The heat generated by the heating element is transferred to the heat-conducting bottom wall of the heat sink through the casing and then transferred to the hydrogel phase change structure through the heat-conducting bottom wall.
After the hydrogel phase change structure reaches the phase change temperature, the internal water evaporates through the first The ventilation holes on the cavity wall are diffused to the outside of the heat sink, thereby realizing the heat dissipation effect on the electronic device.
The above is the solution for the mobile phone heat dissipation protective cover equipped with hydrogel material invented by OPPO. The hydrogel phase change structure in this solution causes the internal moisture to undergo a phase change and generate water vapor by absorbing heat, and the water vapor passes through the cavity wall.
The ventilation holes are transmitted to the outside of the heat sink, thereby realizing heat dissipation. The solution can realize heat dissipation without external energy and has high heat dissipation efficiency.
