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Apple developing upcoming ‘M2’ chip with help of Samsung Electro-Mechanics
According to the latest report, Apple is developing the upcoming “M2” chip with the help of Samsung Electro-Mechanics. Samsung Electro-Mechanics reportedly offers an FC-BGA (flip-chip ball grid array) package for the M1 chip. Moreover, Apple’s “M1” chip was only discovered to use Samsung’s FC-BGA nearly a year after its launch.
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Furthermore, Samsung is expected to continue supplying FC-BGAs for the “M2.” Samsung is working with Apple on the “M2” chip and will complete work on its FC-BGA this year. The Elec reports that Apple began developing the “M2” immediately after the “M1” chip was introduced.
Apple has now announced that it will hold its annual Worldwide Developers Conference (WWDC) online from June 6th to 10th.