TSMC is said to start mass-producing chips using the N2 (2nm-class) process by the end of 2025 and deliver the first chips in early 2026. The first customers will be Apple and Intel.
“TSMC’s N2 process expansion plans at Fab 20 (Hsinchu) will become clearer,” Huaxing Securities analyst Sze Ho Ng wrote in a client note, according to TomsHardware. “According to the company’s plan, equipment move-in is expected to Start in late 2022.”
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Sze Ho Ng believes that Intel will have N2 product risk production (consumer PC Lunar Lake GPU) by the end of 2024. Although Lunar Lake will use TSMC’s N2 process is only speculated, Intel’s previous PPT has made it clear that Lunar Lake’s GPU will use more advanced technology than N3 for external manufacturing.
For Apple, Sze Ho Ng pointed out that it will become a major customer for TSMC to provide dedicated capacity support. However, it is still unclear which SoCs Apple will use in the N2 process at that time, as mass production is still some time away.
According to a previous report by Digitimes, companies such as AMD, Broadcom, Nvidia, and MediaTek are also expected to be able to negotiate the allocation of N2 starting next year, regardless of whether these companies will adopt the N2 process later than Apple and Intel.
