According to the latest report, Samsung attacked the advanced wafer foundry process. After announcing that 3nm leads the industry in mass production at the end of June, the 4nm yield rate has improved significantly, and it is starting to expand production. It is expected that this year, Q4 will add 20,000 pieces of production capacity per month, and plan to invest about 5 trillion won in 4nm, competing with TSMC, and trying to grab more Qualcomm and AMD from TSMC, Nvidia, and other large manufacturers foundry orders.
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For related news, Samsung said it could not confirm the increase in production and investment. TSMC also did not respond to relevant competitor information yesterday. The industry pointed out that in the past, about 60% of Samsung’s wafer foundry production capacity provided its own chip production, and the rest took out outsourced orders. Research institutions estimate that Samsung is still only about one-fifth of TSMC’s advanced manufacturing capacity.
The first batch of chips manufactured by Samsung Electronics using the 3nm process technology will be officially shipped on July 25. Its process technology is the first in the industry to adopt a full-surround gate transistor architecture, and its mass production and delivery time are earlier than its competitor TSMC.
In April this year, it was reported that Samsung’s 4nm node production capacity has experienced some delays, but it has entered the expected yield curve; its 5nm yield has entered a mature stage, which means that the yield has entered Samsung’s expected level. There are rumors that Samsung Electronics Foundry’s 4nm process output has been delayed, causing major customers such as Nvidia to entrust the foundry company’s new generation of products to TSMC.
