According to the latest report, sources at IC design companies revealed that although rival Samsung Electronics is actively competing for 3nm chip orders, TSMC continues to receive 3nm chip order commitments from suppliers such as Apple and Intel.
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Samsung is working to expand its 3nm customer portfolio but has yet to make significant progress, the sources said. For TSMC’s 3nm customers, shifting orders from TSMC can be costly. TSMC’s 3nm process will still use the FinFET transistor structure, while Samsung’s 3nm node uses the GAA transistor structure. Samsung is even ahead of TSMC in shifting 3nm process technology to mass production.
However, sources such as AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm have all placed orders for 3nm chips from TSMC. But Samsung’s 3nm GAA process has yet to attract orders from major chip suppliers. Qualcomm is seen as the most likely customer for Samsung’s 3nm GAA process, given the fabless supplier’s supplier diversification strategy and other considerations for its business with Samsung’s mobile division, the sources said.