OmniVision Group announced the release of the industry’s first and only three-layer stacked BSI global shutter (GS) image sensor OG0TB. OmniVision says this ultra-small size image sensor is used for eye and face tracking in AR/VR/MR and Metaverse consumer devices, in a package size of just 1.64mm x 1.64mm, with 2.2-micron pixel size and 1 /14.46-inch Optical Format (OF).
JOIN TIP3X ON TELEGRAM
In addition, this CMOS image sensor has a 400×400 resolution and ultra-low power consumption. OmniVision data shows that the OG0TB BSI GS image sensor consumes less than 7.2 mW at 30 frames per second.
The OG0TB GS uses OmniVision PureCel Plus-S chip stacking technology, and uses a three-layer stacked sensor with a pixel size of 2.2 microns in a 1/14.46-inch optical format, reaching a resolution of 400×400 and supporting multi-point MIPI, CPHY, SPI, and other interfaces.
It is reported that the OG0TB GS image sensor will provide samples in the third quarter of 2022, and mass production will begin in the second half of 2023.
